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A: There are many places where you can get a DTG compatible pritner, the manufacturers of printers like Deaqdo and Epson make different models that will work with their own machines, or if you have a brother, sister, or friend that has a laser printer then you can get a DTG compatible printer. There are many companies that make the supplies, Deaqdo makes the DTG printer, the link is above. If you go with a place that is not known the guarantee will be much less as you do not know the reputation of the company. For the software being cracked, there is some really good software. Deaqdo DTG Printer W/ Maintenance Software Epson SP4000 series Brother MFP Series Some of the software that has been cracked have been found to work with just a little help from the crack and there is some really good software out there that is free. There are different software programs out there DTG Inks - Free DTG Inks Pro - not free 1. Field of the Invention The present invention relates to a method of thinning a semiconductor film, and a semiconductor device including the thinned semiconductor film. 2. Description of the Related Art A semiconductor device such as a semiconductor light emitting element includes a semiconductor layer made of a silicon compound (e.g., SiC). However, since a silicon compound has low cleavage energy, the semiconductor layer is easily damaged or destroyed. Further, when the semiconductor layer is thinned by a wet etching method, the layer is undesirably removed before the etching process is completed. Thus, a dry etching method is used to form a thinned semiconductor film. In the dry etching method, however, carriers are generated on the surface of the semiconductor layer when active species attach to the surface, and the carriers cause undesired effects on a device including the semiconductor layer. For example, Japanese Patent Laid-Open No. 2010-233077 discloses an amorphous Si thin-film etching apparatus. In the disclosed thin-film etching apparatus, a first plasma processing chamber and a second plasma processing chamber are provided. A rotational disk having a ring-shaped concave portion is disposed in the first plasma processing chamber. Then, a first plasma is generated in the first plasma processing chamber, and then a sheet material that has a semiconductor layer

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